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products structure: silicon hybrid integrat ed circuit this product has no designed protection against radioactive rays. 1/ 24 tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 14 ? 001 tsz22111 ? 14 ? 001 high speed digital isolator 2500 vrms 2ch BM67220FV-C general description the BM67220FV-C is a high-speed isolator ic used in electric vehicles and hybrid vehicles. this ic features dielectric strength of 2500 vrms between i/o. maximum propagation delay time is 45 ns. features 1. dielectric strength of 2500 vrms between i/o 2. maximum propagation delay time of 45 ns 3. built-in 2ch uni-directional propagation 4. aec -q100 qualified 5. ul 1577 recognized:file no. e356010 applications propagation of logic signal within electric and hybrid vehicles key specification ? supply voltage range: 4.5v to 5.5v ? propagation delay: 45ns (max) ? stand-by current: 0a (typ) ? operating temperature range: -40c to +125c package w(typ) x d(typ) x h(max) typical application circu it figure 1 . bm67220 fv -c application example * please connect bypass capacitor directly to the ic pin. gnd2 out1 out2 9 gnd1 20 6 in1 15 in2 16 5 s r q pulse generator pulse generator vcc1 4 vcc2 17 11 2 uvlo uvlo 8 ten1 13 ten2 s r q pulse generator pulse generator en1 7 en2 14 lvg. hvg. hvg. lvg. * * ss op -b20w 6.50mm x 8.10mm x 2.01 mm datashee t downloaded from: http:///
2/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 pin configuration figure 2. bm67220 fv -c package (ssop-b20w) pin description no. pin name function no. pin name function 1 nc no connection 20 gnd2 ground 2 2 gnd1 ground 1 19 nc no connection 3 nc no connection 18 nc no connection 4 vcc1 power supply 1 17 vcc2 power supply 2 5 in 2 input 2 16 out2 output 2 6 in1 input 1 15 out1 output 1 7 en1 enable input 1 14 en2 enable input 2 8 ten1 test mode input 1 13 ten2 test mode input 2 9 gnd1 ground 1 12 nc no connection 10 nc no connection 11 gnd2 ground 2 nc gnd1 nc vcc1 in2 in1 en1 ten1 gnd1 nc gnd2 nc nc vcc2 out2 out1 en2 ten2 nc gnd2 downloaded from: http:///
3/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 description of operation 1. input/output logic the input/output logic levels for the bm67220 fv -c are as shown in the table below. no. en1 en2 in1 in2 out1 out2 1 l l x x l l 2 l h l l * * 3 l h * * 4 h l * * 5 h h * * 6 h l l l l l 7 l h l l 8 h l l l 9 h h l l 10 h h l l l l 11 l h l h 12 h l h l 13 h h h h * retains its previous state in case en1 and en2 pins are "l" as in no. 1, the logic of out1 pin an d out2 pin becomes "l". in case en1 pin is "l" and en2 pin is "h" as in no. 2 ~ 5, the logic of out1 pin and out2 pin will retain its previous st ate. in case en2 pin is "l" and en1 pin is "h" as in no. 6 ~ 9, the logic of o ut1 pin and out2 pin becomes "l". in case en1 and en2 pins are "h" as in no. 10 ~ 13, the output lo gic of out1 (out2) pin changes according to the input logic of in1 (in2) pins. likewise, since pull up/pull down resistor has not been c onnected to in1, in2, en1 and en2 pins, it is necessary to connect external resistor in case you would like to fix the input l ogic of in1, in2, en1 and en2 pins. 2. ten pins the ten pins serve as a test enable pin, respectively. please connect to gnd to avoid the possibility of chip malfu nction. 3. output pin voltage logic levels for output pins are indicated in the truth ta ble in sections 1, 6, and 7. however, it may be assumed that such logic levels disable the output circuit to fully turn on at a low voltage when turning on or off the power supp ly, thus putting the output pin into the high impedance state. 4. under voltage lock out (uvlo) function this ic has a built- in uvlo function to prevent the ic from malfunctioning whenever the pow er supply voltage drops. it triggers the uvlo state when vcc1 pin and vcc2 pin are changed to 3.8v (typ) or less and becomes in operational state when changed to 4.0v (typ) or more. if vcc1 drops to 3.8v or less, both out1 and out2 pins retain its state. if vc c2 drops to 3.8v or less, both out1 and out2 pins will be set to l logic level. in case vcc2 pin voltage was changed from 3.8v (typ) or less to 4.0v (typ) or more at 4.0v (typ) or more for vcc1 pin voltage, the output logic of out1 pin and out2 pin becomes "l". in case vcc1 pin voltage was changed from 3.8v (typ) or less to 4.0v (typ) or more at 4.0v (typ) or more for vcc2 pin voltage, the output logic of out1 (out2) pin changes according to the input logic of input in1 (in2) pin. 5. under voltage lock out (uvlo) function masking time this ic provides masking time for the uvlo function. the masking time is set to 10 sec (typ). downloaded from: http:///
4/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 6. input/output logic levels with power supply turned off the following table shows the output logic levels accordin g to the order in which the power supply turns off. no. power supply in1 in2 out1 out2 1 vcc1 l l l l 2 l h l h 3 h l h l 4 h h h h 5 vcc2 l l l l 6 l h l l 7 h l l l 8 h h l l the output logic of out1 pin and out2 pin is in a maintained state in case vcc1 is turned off as in no. 1 ~ 4. the output logic of out1 pin and out2 pin is l in case vcc2 is turned off as in no. 5 ~ 8 . 7. output logic levels with power supply turned on the following table shows the output logic levels accordin g to the order in which the power supply turns on. no. turning- on order1 turning- on order2 in1 in2 out1 out2 1 vcc1 vcc2 l l l l 2 l h l l* 3 h l l* l 4 h h l* l* 5 vcc2 vcc1 l l l l 6 l h l h 7 h l h l 8 h h h h *different input and output logic in case vcc1 is turned on first as in no. 1 ~ 4, a signal from vcc1 side to the circuit of vcc2 side cannot be received because of the cancellation by the signal before the circu it of vcc2 (receiving) side rises. for that reason, the output logic of out1 pin and out2 pin bec ome "l" and the output logic does not match with the input logic as in no. 2, 3, 4*. downloaded from: http:///
5/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 timing chart figure 3. vcc1 to vcc2 (in1=l, in2=l) figure 4. vcc1 to vcc2 (in1=h, in2=h) vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off uvlo on input inhibition area max. 500 s input inhibition area max. 500 s vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s input inhibition area max. 500 s mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) downloaded from: http:///
6/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 timing chart - continued figure 5. vcc1 to vcc2 (in1=l to h, in2=l to h) figure 6. vcc1 to vcc2 (in1=h to l, in2=h to l) vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s ) input inhibition area max. 500 s mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s input inhibition area max. 500 s downloaded from: http:///
7/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 timing chart - continued figure 7. vcc2 to vcc1 (in1=l, in2=l) figure 8. vcc2 to vcc1 (in1=h, in2=h) vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s input inhibition area max. 500 s vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s input inhibition area max. 500 s mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) mask time ( typ. 10 s ) downloaded from: http:///
8/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 timing chart - continued figure 9. vcc2 to vcc1 (in1=l to h, in2=l to h) figure 10. vcc2 to vcc1 (in1=h to l, in2=h to l) vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s input inhibition area max. 500 s mask time ( typ. 10 s ) mask time ( typ. 10 s ) vcc1 vcc2 en1 en2 in1 in2 out1 out2 uvlo off u vlo on uvlo off u vlo on input inhibition area max. 500 s input inhibition area max. 500 s mask time ( typ. 10 s ) mask time ( typ. 10 s ) downloaded from: http:///
9/ 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol rating unit BM67220FV-C power supply voltage 1 v cc1 7.0 (note 1) v power supply voltage 2 v cc2 7.0 (note 2) v in1 pin voltage v in1 -0.3 to +7.0 (note 1) v in2 pin voltage v in2 -0.3 to +7.0 (note 1) v out1 pin voltage v out1 -0.3 to +7.0 (note 2) v out2 pin voltage v out2 -0.3 to +7.0 (note 2) v output current i omax(out) 10 (note 3) ma gnd1-gnd2 ground potential v gnd 2500 vrms operating temperature range t opr -40 to +125 c storage temperature range tstg -55 to +150 c power dissipation pd 1.19 (note 4) w maximum junction temperature tjmax 150 c (note 1 ) re ference to gnd1. (note 2) re ference to gnd2. (note 3) should not exceed pd and aso. (note 4) derate by 9.52mw/c when operating above ta=25c , when mounted on a glass epoxy board measuring 70 mm ? 70 mm ? 1.6 mm (including a copper foil area of 3% or less). caution: operating the ic over the absolute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important t o consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings recommended operating conditions parameter symbol BM67220FV-C unit power supply voltage 1 v cc1 4.5 to 5.5 (note 5) v power supply voltage 2 v cc2 4.5 to 5.5 (note 6) v (note 5 ) relative to gnd1 (note 6) relative to gnd2 insulation related characteristics parameter symbol characteristic unit insulation resistance (v io =500v) r s >10 9 insulation withstand voltage/1min v iso 2500 vrms insulation test voltage/1s v iso 3000 vrms ul1577 ratings table following values are described in ul report. parameter values units conditions side 1 circuit current 0.21 ma vcc1=5v side 2 circuit current 0.21 ma vcc2=5v side 1 consumption power 1.05 mw vcc1=5v side 2 consumption power 1.05 mw vcc2=5v isolation voltage 2500 vrms maximum operating (ambient) temperature 125 maximum junction temperature 150 maximum strage temperature 150 maximum data transmission rate 20 mhz downloaded from: http:///
10 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 electrical characteristics (all values at ta ? - 40 ? c to125 ? c and vcc ? 4.5v to 5.5v, unless otherwise specified) parameter symbol limit unit conditions min typ max vcc1 power supply current, quiescent i cc1stby - 0 10 a en1 = 0 vcc2 power supply current, quiescent i cc2stby - 0 10 a en2 = 0 vcc1 power supply current, dc i cc1q - 0.21 0.42 ma v in = 0 or v cc vcc2 power supply current, dc i cc2q - 0.21 0.42 ma v in = 0 or v cc vcc1 power supply current, 10kbps i cc10k1 - 0.23 0.50 ma f in : 5khz vcc2 power supply current, 10kbps i cc10k2 - 0.22 0.48 ma f in : 5khz vcc1 power supply current, 1mbps i cc1m1 - 1.36 3.20 ma f in : 500khz vcc2 power supply current, 1mbps i cc1m2 - 0.40 1.00 ma fin : 500khz in1,in2 input inhibition area t in - - 500 (note 7) s high-level output voltage v oh v cc -0.5 v cc -0.3 v cc v i o =-4 ma low -level output voltage v ol 0 0.2 0.4 v i o =4 ma (note 7) please do not switch the input signal in1 and in2 between t in sections . output may not match the logic input. figure 11. in1, in2 input inhibition area vcc1 vcc2 en1 en2 t in t in downloaded from: http:///
11 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 electrical characteristics - continued (all values at ta=- 40 ? c to +125 ? c and v cc ? 4.5v to 5.5v, unless otherwise specified) parameter symbol limit unit conditions min typ max input current i in - 0 10 a v in =v cc high-level input threshold v inh v cc 0.7 - v cc v low -level input threshold v inl 0 - v cc 0.3 v input current i en - 0 10 a v en =v cc high-level input threshold v enh v cc 0.7 - v cc v low -level input threshold v enl 0 - v cc 0.3 v input current i ten 30 50 70 a v t_ en =v cc high-level input threshold v tenh v cc 0.7 - v cc v low -level input threshold v tenl 0 - v cc 0.3 v propagation delay (low to high) t plh 10 20 45 ns propagation delay (high to low) t phl 10 20 45 ns propagation distortion |t plh - t phl | - 0 8 ns rise time t r - 2.5 - ns fall time t f - 2.5 - ns common-mode transient immunity cm l - 35 - kv/s design assurance input/output timing figure 12. input/output timing chart in1, in2 out1, out2 10% 90% 90% 10% 50% 50% tr tplh tphl tf 50% 50% t phl t phl t r t f downloaded from: http:///
12 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 typical performance curve figure 15. input current vs input voltage figure 16. input voltage v s input voltage (input current at input pin) (high-/low-level input threshold , v cc1 , v cc2 4.5v) 0.0 0.1 0.2 0.3 0.4 0.5 4.50 4.75 5.00 5.25 5.50 supply voltage : vcc [v] circuit current : icc [ma] 125c 25c -40c supply voltage: v cc [v] circuit current : i cc [ma] figure 13. circuit current vs supply voltage figure 14. circuit curre nt vs supply voltage (vcc1 power supply current) (vcc2 power supply current, dc) 0.0 0.1 0.2 0.3 0.4 0.5 4.50 4.75 5.00 5.25 5.50 supply voltage : vcc [v] circuit current : icc [ma] 125c 25c -40c supply voltage: v cc [v] circuit current : i cc [ma] -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 1 2 3 4 5 input voltage : v in [v] output voltage : [v] 125c -40c 25c 125c 25c -40c output voltage: v out [v] -2 0 2 4 6 8 10 0 1 2 3 4 5 input voltage : v in [v] input current : [a] 125c 25c -40c oinput current: i in [a] downloaded from: http:///
13 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 typical performance curve - continued figure 17. ou tput voltage vs input voltage figure 18. output voltage vs input voltage (high-/low-level input threshold, v cc1 , v cc2 5.0v) (high-/low-level input threshold, v cc1 , v cc2 5.5v) figure 19. output voltage vs output current figure 20. output volt age vs output current (high-level output voltage, v cc1 , v cc2 4.5v) (high-level output voltage , v cc1 , v cc2 5.0v) 3.5 3.7 3.9 4.1 4.3 4.5 0 2 4 6 8 10 output current : l o [ma] output voltage : v oh [v] 25c -40c 125c output voltage: v oh [v] 4.0 4.2 4.4 4.6 4.8 5.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v oh [v] 25c -40c 125c output voltage: v oh [v] output voltage: [v] -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 1 2 3 4 5 input voltage : v in [v] output voltage : [v] 125c 25c -40c 125c 25c -40c output voltage: v out [v] -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 1 2 3 4 5 input voltage : v in [v] output voltage : [v] 125c 25c -40c 125c 25c -40c output voltage: v out [v] downloaded from: http:///
14 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 typical performance curve - continued ? figure 21. output voltage vs output current figure 22. output volt age vs output current (high-level output voltage, v cc1 , v cc2 5.5v) ( low -level output voltage, v cc1 , v cc2 4.5v) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v ol [v] 25c -40c 125c 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v ol [v] 25c -40c 125c figure 23. output voltage vs output current, figure 24. output voltag e vs output current ( low -level output voltage , v cc1 , v cc2 5.0v) ( low -level output voltage, v cc1 , v cc2 5.5v) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v ol [v] 25c -40c 125c output voltage: v ol [v] output voltage : v ol [v] output current: i o [ma] output current: i o [ma] 4.5 4.7 4.9 5.1 5.3 5.5 0 2 4 6 8 10 output current : l o [ma] output voltage : v oh [v] 25c -40c 125c output voltage: v oh [v] output voltage : v ol [v] downloaded from: http:///
15 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 typical performance curve - continued 16 17 18 19 20 21 22 23 24 25 26 -50 -25 0 25 50 75 100 125 150 temperature : [ ] propagation delay : [ns] t phl t phl 16 17 18 19 20 21 22 23 24 25 26 -50 -25 0 25 50 75 100 125 150 temperature : [ ] propagation delay : [ns] 16 17 18 19 20 21 22 23 24 25 26 -50 -25 0 25 50 75 100 125 150 temperature : [ ] propagation delay : [ns] 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current : icc[ma] 25c -40c 125c figure 25. propagation delay vs temperature figure 26. propagati on delay vs temperature (v cc1 , v cc 2 = 4.5v) (v cc1 , v cc 2 = 5.0v) figure 27. propagation delay vs temperature figure 28. circuit curr ent vs input frequency (v cc1 , v cc 2 = 5.5v) (vcc1 power supply current ,v cc1 , v cc 2 = 4.5v) temperature: [c] temperature: [c] temperature: [c] circuit current : i cc [ma] t phl t plh t phl t plh downloaded from: http:///
16 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 typical performance curve - continued 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current :icc[ma] 25c -40c 125c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency :[mbps] circuit current :icc[ma] 25c -40c 125c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current : icc[ma] 25c 125c -40c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current : icc[ma] 25c 125c -40c figure 29. circuit current vs input frequency figure 30. circuit current v s input frequency (vcc1 power supply current , v cc1 , v cc 2 = 5.0v) (vcc1 power supply current v cc1 , v cc 2 = 5.5v) figure 31. circuit current vs input frequency figure 32. circuit current vs input frequency (vcc2 power supply current, v cc1 , v cc 2 = 4.5v ) (vcc2 power supply current, v cc1 , v cc 2 = 5.0v) circuit current : i cc [ma] circuit current : i cc [ma] circuit current : i cc [ma] circuit current : i cc [ma] downloaded from: http:///
17 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 typical performance curve - continued 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current icc[ma] 25c -40c 125c figure 33. circuit current vs input frequency (vcc2 power supply current , v cc1 , v cc 2 =5.5v) circuit current : i cc [ma] downloaded from: http:///
18 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 i/o equivalent circu it figure 34. in1, in2 figure 35. out1, out2 figure 36. t_en1, t_en2 figure 37. en1, en2 in1 in2 vcc1 out1 gnd vcc2 out2 vcc1 vcc1 100k t_en1 t_en2 vcc2 en1 en2 vcc2 downloaded from: http:///
19 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 power dissipation reduction characteristics thermal dissipation in consideration of the power consumption (p), package power d issipation (pd), and ambient temperature (tj) of this ic, ensure that the operating temperature of the chip will not exceed 150 ? c. if tj is beyond 150 ? c, parasitic elements may malfunction and may cause leakage current to increase. co nstantly using the ic under the said conditions may deterior ate the ic and further lead to its breakdown. strictly keep tjmax at 150 ? c under any circumstances. 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 1.19w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 1.19w measuring equipment: th156 (kuwano electric) me asuring condition: mounted on the rohms board board size: 70 ? 70 ? 1.6 mm 3 single-layer board: ? ja ? 105.3 ? c/w figure 3 8. ssop-b20w power dissipation reduction curve power dissipation: pd [w] ambient temperature: ta [c] downloaded from: http:///
20 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pi n at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is w hen the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and dela ys, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and stora ge. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
21 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor . the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regard in g the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occ ur in the structure of the ic. the operation of parasitic dio des can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) shoul d be avoided. appendix: example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric co nstant considering the change of capacitance with te mperature and the decrease in nominal capacitance due to dc bias an d others. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
22 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 ordering information b m 6 7 2 2 0 f v - ce 2 part number package fv : ssop-b20w packaging and forming specification e2: embossed tape and reel marking diagram 1pin mark product name. lot no. ss op -b20w top view bm67220 downloaded from: http:///
23 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name ssop-b20w downloaded from: http:///
24 / 24 BM67220FV-C tsz02201-0 72 7a bg 00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2015 rev.005 http://www.rohm.co.jp tsz22111 ? 15 ? 001 revision history date revision changes 25.jun.2012 001 new release 26.oct.2012 002 p.3 fix typo about 4) under voltage lock out. p.7 fix typo about figure 8.sequence. p.10 fix typo about electrical characteristics about in1, in2 input inh ibition area. 20.dec.2012 003 p.5~p.8 fix typo about input inhibition area. p.11 add minimum propagation delay. p.21 delete description. 05.mar.2013 004 p.1 add a description 4 ) aec -q100 qualified at features applied new style and improved understandability. 25.dec.2015 005 p.1 add a description 5 ) ul 1577 recognized at features p.9 add ul1577 ratings table downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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